Simon Industries offers extensive design and manufacturing experience related to embedded applications which require conduction-cooled, and air-cooled heat frame assemblies, and heatsinks. Remaining alert to the latest industry guidelines, allows Simon to offer a unique total solution to a multifaceted design and production challenge.

Simon's engineering team is flexible, experienced, and accessible to your design team throughout development of a rugged single board computer. Provided your precise specifications, constraints, and targeted levels of ruggedization, Simon will design a heat frame to perfectly fit your board using SolidWorks or IronCAD modeling tools. We can then model its thermal and structural performance with the CFD and FEA software we utilize, thus validating the mechanical and thermal design before your company invests in costly prototypes and production activity.